According to a report by tipster Ice Universe (spotted by Sammobile), the company is expected to share more details about its new flagship chipset during the launch of the Galaxy S23 series. The report also claims that Samsung MX’s CEO TM Roh is also likely to tease the upcoming premium smartphone chip at the Galaxy Unpacked 2023 event which is scheduled for February 1. As per the report, the company is reportedly developing this new chipset for the Galaxy S25 series that is expected to be launched two years from now.
Samsung new flagship chipset: Expected details
The company has shared no official details about its first-ever high-end chipsets. However, a few specifications of the same has already been leaked online. Rumours claim that the new mobile platform will be made using Samsung Foundry’s second or third-generation 3nm GAA fabrication process.
Samsung MX has also created a team of over a thousand engineers, including a veteran semiconductor specialist from Apple for its first-ever flagship chipset, the report adds. If this chipset turns out to be successful, the company may remove the Exynos chips from the upcoming Galaxy smartphones and tablets.
What will happen to the Exynos chip-building team
The report adds that the Exynos chipset team is currently employed by Samsung’s System LSI division. Rumours suggest that this team may limit itself to making semiconductor chips for automobiles and helping other brands like Google co-develop mobile chips. However, Samsung is likely to release mid-range Galaxy smartphones powered by Exynos processors over the next few years.
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